Corning Cable Systems offers the broadest range of end-to-end fibre optic and copper product solutions for telecommunications networks. Corning wanted to improve their supply chain to reduce inventory levels (thereby adding to bottom line savings) and reduce overall administrative costs- all without expensive or time-consuming investments.
General Cable operates 28 manufacturing locations in 8 countries and is a leader in the development, design, manufacture, marketing and distribution of copper, aluminum and fiber optic wire and cable products. Their products are widely used in communications, energy, industrial and speciality markets. General Cable has nearly 300 suppliers of raw material for their US operations.
This paper presents the value of an enterprise POL based on a Bell Labs economic analysis. It examines the financial benefits of an optical network compared to traditional copper-based Ethernet architectures. Also discussed in this white paper is why a POL provides the most cost-effective option to meet the gigabit speed networking challenges of a future digital enterprise.
Published By: Skillsoft
Published Date: Mar 27, 2015
Read peer insight by HR leaders at Rent-A-Center, Madonna University & Copper Phoenix Consulting,
Schnitzer Steel and Southwestern Energy Company and get actionable ideas on effective approaches for recruiting and retaining the “millennials” generation that has been alternatively described as entitled and creative.
Published By: copperegg
Published Date: Dec 10, 2013
Monitor multiple servers at the same time, from the same interface. Whether your servers are physical, virtual, on-premise, in the cloud, or a combination of these, get the server performance insight you need from any location.
High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.
This white paper takes a close look at the importance of moving to an agile, high-performance, next-generation data center network with three key areas that need to be addressed in order to do so: The Data Center Interconnect, Cloud Connectivity, and Building Cloud-Aware Networks.